- High-resolution imaging for X-ray, UV, visible, IR, and THz detectors
- DMD-based modulation for visible/NIR; custom masks for X-ray/THz
- Single-pixel detector reconstructs up to 1024×1024 images; typical 256×256
- Snapshot hyperspectral imaging bypassing traditional scan trade-offs in spatial-temporal-spectral resolution
- Single-frame grayscale can reconstruct dozens of hyperspectral frames
- Supports large-area imaging chips: max 1024×1024; spectral resolution up to 2 nm, max 190 bands; typical 30–60 bands
- Evaluates temporal response and intensity linearity of imaging chips
- Single camera + spatial light coding reconstructs dozens of dynamic frames from one snapshot
- Max 1024×1024; typical 256×256; frame rate boosted 10–100× depending on scenario
- Electrical characterization including I–V, dark current, photocurrent, turn-on voltage, and noise measurements
- Quantitative evaluation of leakage current, junction quality, and device interface performance
- Optoelectronic testing including External Quantum Efficiency (EQE), responsivity, detectivity (D*), spectral response, and response time
- Supports device performance benchmarking, process validation, and technology development
- Integrates DQE, Noise Power Spectrum (NPS), and Modulation Transfer Function (MTF)
- Adaptive algorithms remove fixed-pattern noise, dead pixels, horizontal striping, and perform per-pixel gain calibration.
- Supports scintillators (CsI, LYSO), semiconductors (CdZnTe, perovskites), and EM-shielded packaging
- Meets IEC 62220-1 standards for metrology-grade SWIR/X-ray imaging systems
- Absolute photon yield measurement (photons/MeV) under radiation or particle excitation
- High accuracy, sensitivity, and material compatibility (inorganic, organic, novel scintillators)
- Key for new scintillator characterization, radiation detector selection, and medical imaging components (e.g., PET)
