Inspects sealed containers, liquid levels, and encapsulated electronics through SWIR-transparent plastics
SWIR Advantage: See-through capability for polymers; high-throughput, contactless quality control
Enables inspection of subsurface defects, cracks, and thickness variations in silicon and compound semiconductor wafers
SWIR Advantage: penetrates silicon; reveals hidden subsurface defects; non-destructive
Detects micro-cracks, inactive regions, and hidden electrical defects in photovoltaic cells
SWIR Advantage: high sensitivity to weak IR emission; non-destructive solar cell metrology; industry-proven method
We welcome opportunities to collaborate with customers, researchers, and industry partners worldwide.
308, Guanggu Overseas Talent Innovation Park (Donghu Hi-tech Haichuangyuan), Wuhan, Hubei, P.R.China
Business Collaboration: zhangxiao@inrighttech.com
Media Collaboration: mjwu@inrighttech.com
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