One-stop support covering materials, ROICs, SWIR sensors, prototype development, process integration, characterization, and technical services.
Multi-spec Array Substrates
Material Synthesis
Monolithic Integration
Imaging Chip Fabrication
Wire Bonding
Integrated Packaging
Reliability Testing (Hermeticity, Die Shear & Wire Bond Pull, Mechanical Shock & Vibration)
Imaging Modules
Performance Testing
Certification & Failure Analysis (FA)
Global academic & research partners
University faculty & scientific researchers served
Imaging tests completed
Imaging chips processed & fabricated
InRight Tech's Monolithic Integration and Imaging Characterization Platform has supported numerous research projects resulting in publications in leading scientific journals.
End-to-end micro/nano fabrication, die bonding, packaging, and reliability testing for monolithic and heterogeneous integrated imaging devices.
Advanced SWIR imaging and optoelectronic characterization platforms for spatial, spectral, temporal, and quantum-efficiency testing of imaging chips and FPAs.
We welcome opportunities to collaborate with customers, researchers, and industry partners worldwide.
308, Guanggu Overseas Talent Innovation Park (Donghu Hi-tech Haichuangyuan), Wuhan, Hubei, P.R.China
Business Collaboration: zhangxiao@inrighttech.com
Media Collaboration: mjwu@inrighttech.com
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WeChat Company Account
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