Services

END-TO-END SWIR ENGINEERING Platform

One-stop support covering materials, ROICs, SWIR sensors, prototype development, process integration, characterization, and technical services.

Multi-spec Array Substrates

Material Synthesis

Monolithic Integration

Imaging Chip Fabrication

Wire Bonding

Integrated Packaging

Reliability Testing (Hermeticity, Die Shear & Wire Bond Pull, Mechanical Shock & Vibration)

Imaging Modules

Performance Testing

Certification & Failure Analysis (FA)

Global Partners

80+

Global academic & research partners

400+

University faculty & scientific researchers served

2,800+

Imaging tests completed

600+

Imaging chips processed & fabricated

InRight Tech's Monolithic Integration and Imaging Characterization Platform has supported numerous research projects resulting in publications in leading scientific journals.

Representative Publications by Our Customers

Nature Photonics
Nature Electronics
Nature Communications
Advanced Materials
Matter & Light and more...

Joint Paper

First published: 16/06/2022

A near-infrared colloidal quantum dot imager with monolithically integrated readout circuitry

Authors: Jing Liu, Peilin Liu, Dengyang Chen, Tailong Shi, Xixi Qu, Long Chen, Tong Wu, Jiangping Ke, Kao Xiong, Mingyu Li, Haisheng Song, Wei Wei, Junkai Cao, Jianbing Zhang, Liang Gao & Jiang Tang

DOI: 10.1038/s41928-022-00779-x

First published: 02/09/2023

Flexible and broadband colloidal quantum dots photodiode array for pixel-level X-ray to near-infrared image fusion

Authors: Jing Liu, Peilin Liu, Tailong Shi, Mo Ke, Kao Xiong, Yuxuan Liu, Long Chen, Linxiang Zhang, Xinyi Liang, Hao Li, Shuaicheng Lu, Xinzheng Lan, Guangda Niu, Jianbing Zhang, Peng Fei, Liang Gao & Jiang Tang

DOI: 10.1038/s41467-023-40620-3

First published: 23/07/2024

Synergism in Binary Nanocrystals Enables Top-llluminated HgTe Colloidal Quantum Dot Short-Wave Infrared Imager

Authors: Binbin Wang, Mohan Yuan, Jing Liu, Xingchen Zhang, Jing Liu, Ji Yang, Liang Gao, Jianbing Zhang, Jiang Tang, and Xinzheng Lan

DOI: 10.1021/acs.nanolett.4c02235

First published: 24/02/2025

Complementary Passivation of Bidentate Aromatic Ligands Enables High-Temperature Stable PbS Colloidal Quantum Dots Image Sensor

Authors: Long Chen, Shijie Liu, Zunyu Liu, Weidong Wu, Hao Li, Yuxuan Liu, Xing Zhou, Jing Liu, Xinzheng Lan, Luying Li, Jianbing Zhang, Liang Gao, Jiang Tang

DOI: 10.1002/adfm.202501770

First published:

Double-Heterojunction-Based HgTe Colloidal Quantum Dot Imagers

Authors: Huicheng Hu, Jing Liu, Jing Liu, Mohan Yuan, Haifei Ma, Binbin Wang, Ya Wang, Hang Xia, Junrui Yang, Liang Gao, Jianbing Zhang, Jiang Tang, and Xinzheng Lan

DOI: 10.1021/acsnano.4c17257

First published: 29/08/2025

Uncooled and Broadband PbSe Colloidal-Quantum-Dot Short-Wave Infrared Photodetectors

Authors: Hang Xia, Jing Liu, Mohan Yuan, Xudong Hu, Liang Gao, Jianbing Zhang, Jiang Tang, and Xinzheng Lan

DOI: 10.1021/acs.nanolett.5c03752

First published: 20/01/2026

A near-infrared Sn-Pb perovskite imager with monolithic integration

Authors: Ciyu Ge, Chengjie Deng, Jiaxing Zhu, Yongcheng Zhu, Qi Xu, Borui Jiang, Long Chen, Yuxuan Liu, Boxiang Song, Ping Fu, Chao Chen, Liang Gao & Jiang Tang

DOI: 10.1038/s41377-025-02127-y

First published: 17/02/2026

Highly Sensitive All-Polymer Short-Wavelength Infrared Photodetectors for Complementary Metal Oxide Semiconductor Integrated Imaging Enabled by Dual-Acceptor n-Type Polymers

Authors: Yupu Wang, Ruochen Wang, Feng Li, Huimiao Li, Wenkai Zhao, Yunfeng Deng, Guanghui Li, Guankui Long, Yongsheng Chen, Miaomiao Li, Yanhou Geng

DOI: 10.1002/anie.202525467

First published: 20/03/2026

Band-alignment-guided (Bi,Sb)2Se3 alloys for high-performance photodetection and monolithic CMOS-integrated imaging

Authors: Ling Lin, Xinyue Wang, Liang Li, ..., Shenglin Jiang, Guangzu Zhang, Kanghua Li

DOI: 10.1016/j.matlit.2026.100002

First published: 21/03/2026

PbS quantum dot retinomorphic sensors for event-based shortwave infrared imagers

Authors: i Ji, ianhao Zhao, Yuxuan Liu, …, John G. Labram, Can Li , Tianshuo Zhao

DOI: 10.1016/j.device.2026.101111

First published: 24/06/2026

Supramolecular bismuth halide frameworks for monolithic X-ray CMOS imagers

Authors: Xu Wang, Shiwei Zhang, Yamin Chang, Junfang Wang, Zengsheng Li,Yongle Pan, Lixia Wang, Peng Ran, Yang (Michael) Yang, Xiangyue Meng

DOI: 10.1016/j.chip.2026.100214

First published: 30/06/2026

Differential Image Sensor With Decoupled Staticand Dynamic Outputs

Authors: Yegang Liang, Yi Liu, Lin Yuan, Wenhao Ran, Shukun Li, Zeke Liu, Yang Song, Bin Wei, Qingsong Deng, Min Xia, You Meng, Zhuoran Wang, Johnny C. Ho, Guozhen Shen

DOI: 10.1002/adma.73884

Monolithic & Heterogeneous Integration Services

End-to-end micro/nano fabrication, die bonding, packaging, and reliability testing for monolithic and heterogeneous integrated imaging devices.

Thin-Film Deposition & Laser Patterning

Wire Bonding & Multi-Type Packaging

Hermeticity & Reliability Testing

Wafer-to-Wafer Bonding

Die-to-Wafer Bonding

Heterogeneous Integrated Chip Fabrication

Imaging Characterization & Testing Services

Advanced SWIR imaging and optoelectronic characterization platforms for spatial, spectral, temporal, and quantum-efficiency testing of imaging chips and FPAs.

Single-Pixel Imaging

Compressed Spectral Imaging

Compressed Temporal Imaging

Semiconductor Device Characterization & Testing

Detector Quantum Efficiency (DQE) Measurement

Scintillator Light Yield Measurement

Contact Us

We welcome opportunities to collaborate with customers, researchers, and industry partners worldwide.

3F, Optics Valley Overseas Talent Innovation Park, Jiayuan Road, Hongshan District, Wuhan, Hubei Province, China

No.1085, Meiquan Avenue,, Ou Hai District, Wen Zhou, Zhejiang Province, China

Business Collaboration: zhangxiao@inrighttech.com

Media Collaboration: mjwu@inrighttech.com

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Turnkey Monolithic Integration & Sensing Verification Platform Supporting cutting-edge research in multi-material optoelectronic detection:InGaAs | Organic Semiconductors (OSCs) | Perovskites | 2D Materials (Graphene, TMDCs) | CQDs | MEMS Metasurfaces, and other emerging materials.