One-stop support covering materials, ROICs, SWIR sensors, prototype development, process integration, characterization, and technical services.
Multi-spec Array Substrates
Material Synthesis
Monolithic Integration
Imaging Chip Fabrication
Wire Bonding
Integrated Packaging
Reliability Testing (Hermeticity, Die Shear & Wire Bond Pull, Mechanical Shock & Vibration)
Imaging Modules
Performance Testing
Certification & Failure Analysis (FA)
Global academic & research partners
University faculty & scientific researchers served
Imaging tests completed
Imaging chips processed & fabricated
InRight Tech's Monolithic Integration and Imaging Characterization Platform has supported numerous research projects resulting in publications in leading scientific journals.
End-to-end micro/nano fabrication, die bonding, packaging, and reliability testing for monolithic and heterogeneous integrated imaging devices.
Advanced SWIR imaging and optoelectronic characterization platforms for spatial, spectral, temporal, and quantum-efficiency testing of imaging chips and FPAs.
We welcome opportunities to collaborate with customers, researchers, and industry partners worldwide.
3F, Optics Valley Overseas Talent Innovation Park, Jiayuan Road, Hongshan District, Wuhan, China
Business Collaboration: zhangxiao@inrighttech.com
Media Collaboration: mjwu@inrighttech.com
Customer Service WeChat
WeChat Company Account
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