Wafer-to-Wafer Bonding
- Sub-micron alignment and permanent bonding of multi-spec substrates or full wafers
- Full failure analysis with X-Ray, OBIRCH, SEM (non-destructive) and FIB, Decap, cross-section (destructive) methods
- Pinpoints failure mechanisms (ESD, material migration, interface fracture) and provides actionable improvements
- Extended services: film thickness measurement, process verification
